IC card

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5719746
SERIAL NO

08587928

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used. In a still different way, all the space inside the IC card is filled, or a sufficient amount of an adhesive is filled in a space between the two panels around a peripheral thereof. In a further way, the panels are adhered in a thermostat. In a still further way, the panels are adhered with melting at a peripheral thereof.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI DENKI KABUSHIKI KAISHA2-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nishino, Kiyotaka Tokyo, JP 6 90
Ochi, Katsunori Tokyo, JP 22 885
Ohbuchi, Jun Tokyo, JP 15 439
Omori, Makoto Tokyo, JP 26 762
Onoda, Shigeo Tokyo, JP 37 881
Washida, Tetsuro Tokyo, JP 15 264

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