Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
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United States of America Patent
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Feb 17, 1998
Grant Date -
N/A
app pub date -
Sep 26, 1994
filing date -
Sep 26, 1994
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A printed circuit assembly includes a fine pitch flexible printed circuit overlay bonded to a normal pitch printed circuit board. The fine pitch flexible printed circuit overlay may provide increased packaging density, direct chip attachment and/or complex routing with a minimal cost impact on the overall printed circuit assembly.
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