Multilayer printed wiring board with plurality of ground layers forming separate ground planes
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United States of America Patent
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-
Feb 17, 1998
Grant Date -
N/A
app pub date -
Jul 2, 1996
filing date -
Feb 21, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed board 10 is provided with two ground layers 3a, 3b. These ground layers 3a, 3b are electrically insulated inside the printed board. By connecting circuits with different characteristics (low frequency and high frequency, for example) with the different ground layers 3a, 3b, interference of these circuits caused due to a common ground can be minimized.
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Cited Art Landscape
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