Semiconductor pressure sensor with spacing member disposed between sensor and substrate
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United States of America Patent
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Feb 24, 1998
Grant Date -
N/A
app pub date -
Apr 15, 1997
filing date -
Jan 19, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a semiconductor pressure sensor reducing the stress applied by a thick film substrate and preventing the rising of a die bonding material, a sensor chip having a thin wall diaphragm is fixed to a thick film substrate by a die bonding material, such as silicone resin. A convex member of a glass material is interposed between the thick film substrate and the sensor chip and fixed by the die bonding material. With this arrangement, unintended deformation of the diaphragm of the sensor chip can be prevented and a highly accurate, less expensive semiconductor pressure sensor can be provided.
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