Integrated circuit package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 24, 1998
Grant Date -
N/A
app pub date -
Jun 8, 1992
filing date -
Jun 10, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit package comprises a power supply conductor film having a potential and conductor columns insulated from and passed through the power supply conductor film. A power supply conductor column comprises one of the conductor columns connected to a power supply having a potential different from the power supply conductor film. The other conductor columns are signal conductor columns for exchanging signals with mounted integrated circuits. An insulation space between the power supply conductor film and the power supply conductor column is greater than an insulation space between the power supply conductor film and a signal conductor column. Thereby, a probability of short-circuit occurrence in the power supply conductor film across the power supply conductor column is lowered.
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