Method and apparatus for transferring heat from transducer array of ultrasonic probe
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United States of America Patent
Stats
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Feb 24, 1998
Grant Date -
N/A
app pub date -
Dec 29, 1995
filing date -
Dec 29, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device for improving thermal transfer inside an ultrasound probe and reducing heat build-up near the transducer face. The cable components are used as heat conductors which conduct heat out of the probe handle. These heat pipes are coupled to an internal heat conductor which is in heat conductive relationship with the transducer pallet. Thus, heat generated by the transducer array can be transferred, via the internal heat conductor plate and the cable heat conductors, away from the probe surface which contacts the patient. A heat conductive structure can be embedded in the overall shield braid of the cable. Suitable heat conductive structures include thread or wire made of material having a high coefficient of thermal conductivity, as well as narrow tubing filled with heat conductive fluid. Alternatively, inlet and return flow paths for cooling fluid are incorporated in the cable. The inlet and return flow paths inside the cable are respectively connected to the inlet and outlet of a flow path which is in heat conductive relationship with an internal heat conductor in the probe handle.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| GENERAL ELECTRIC COMPANY | 1 RIVER ROAD SCHENECTADY NY 12345 |
International Classification(s)
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Snyder, Jonathan E | Whitefish Bay, WI | 13 | 602 |
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| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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