Technique for improving within-wafer non-uniformity of material removal for performing CMP
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United States of America Patent
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Mar 3, 1998
Grant Date -
N/A
app pub date -
Oct 11, 1996
filing date -
Oct 11, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A platen ring for use with a platen on a linear polisher, in which the platen ring is used to reduce fluctuation of the belt/pad assembly as it encounters the platen. The platen ring is disposed around the platen so that a fluctuation of the belt/pad assembly is dampened before the belt/pad assembly engages the platen. Reduction of the belt/pad fluctuation ensures a reduction in the within-wafer non-uniformity and provides for a more uniform polishing rate across the surface of the wafer.
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