Semi-conductor chip test probe and process for manufacturing the probe

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United States of America Patent

PATENT NO 5723347
SERIAL NO

08736543

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Abstract

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This discloses a probe structure which does not rely on cantilevered wire and which has controlled contact pressure between the probe contacts and the I/O pads on a semi-conductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective leads, formed, on a film stretched across a respective plurality of cavities established in a substrate. The cavities and the contact electrodes are aligned to one another and both positionally match selected I/O pads existing on a semi-conductor chip to be probed. Also disclosed is a probe utilizing a cantilevered, metalized oxide tongue extending across a cavity.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPU S A

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirano, Toshiki Tokyo-to, JP 158 2741
Kimura, Atsuo Ohtsu, JP 8 319
Mori, Shinichiro Kusatsu, JP 99 1130

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