Multilayer wiring structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 3, 1998
Grant Date -
N/A
app pub date -
Mar 11, 1994
filing date -
Mar 11, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer wiring structure comprising a substrate, two line layers, and an interlayer insulating film. The first line layer consists of strip-shaped power/ground lines which extend parallel to one another. The second line layer is located above or below the first line layer, extends substantially parallel to the first line layer. The second line layer consists of strip-shaped signal lines which extend parallel to one another and at an angle to the strip-shaped power/ground lines of the first line layer in a skewed position.
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Family
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Cited Art Landscape
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