Electromechanical assembly having a lid which protects IC chips and holds contact springs
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United States of America Patent
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-
Mar 3, 1998
Grant Date -
N/A
app pub date -
Mar 27, 1996
filing date -
Mar 27, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pressure-mountable, electro-mechanical assembly includes a housing which holds an integrated circuit chip in an open cavity; and, the housing has conductors that connect the chip to a pattern of metal pads on an exterior surface of the housing. A lid lies on the exterior surface of the housing, covers the cavity, and has terminal holes that match and expose the pattern of metal pads. Respective conductive springs are held in the terminal holes, contact the metal pads, and project from the lid. This lid operates as both a protective cover for the chip and a carrier for the springs.
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