Thermoelectric cooling module and method for manufacturing the same
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United States of America Patent
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Mar 10, 1998
Grant Date -
N/A
app pub date -
Jul 25, 1996
filing date -
Jul 27, 1995
priority date (Note) -
Expired
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Abstract
A thermoelectric cooling module, in which an electronic device is cooled due to the Peltier effect of P-type and N-type thermoelectric semiconductor elements, comprising a heat radiating section which comprises a heat radiating electrode having a fin-shaped portion for heat radiation integrally formed, a heat absorbing section comprising heat absorbing electrode contacted with the electronic device, and a thermoelectric conversion section comprising the P-type and N-type thermoelectric semiconductor elements interposed between the heat radiating electrode and the heat absorbing electrode.
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