Method of manufacturing a multilayer electronic circuit
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United States of America Patent
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Mar 17, 1998
Grant Date -
N/A
app pub date -
Jun 11, 1996
filing date -
Jan 8, 1993
priority date (Note) -
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Abstract
A heat resistant multilayer circuit board used in the transportation environment in cars, boats, planes, etc, having two or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, at least one of the conductive layers being affixed to a heat resistant substrate. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
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