Modular die for applying adhesives
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 17, 1998
Grant Date -
N/A
app pub date -
Sep 22, 1995
filing date -
Sep 22, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A modular die for applying hot melt adhesive onto a substrate comprises (a) a manifold having adhesive and air passages formed therein, (b) a plurality of self-contained and interchangeable die bodies mounted on the manifold, and (c) a die head detachably mounted on each die body. The die heads are selected from melt spraying, meltblowing, and linear bead applicators permitting the application of a variety of adhesive patterns on the substrate.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully