Method for making a multi-tier laminate substrate with internal heat spreader
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United States of America Patent
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Mar 17, 1998
Grant Date -
N/A
app pub date -
Oct 17, 1996
filing date -
Mar 13, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multi-tier laminate substrate with an internal heat spreader and method for making a multi-tier laminate substrate with an internal heat spreader for electronic device packaging are provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate.
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