Solder hierarchy for chip attachment to substrates
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United States of America Patent
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Mar 17, 1998
Issued Date -
N/A
app pub date -
Jan 16, 1997
filing date -
May 25, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The method for soldering a chip to a substrate to form a module and then soldering the module to a circuit board includes selecting a three level hierarchy of solders by the temperature required to melt. By this method, a module can be soldered to and de-soldered from a circuit board without affecting adversely the solder between the chip and the substrate. The package formed by this method is free of faults that are caused frequently during both manufacture and service.
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