Prepreg for printed circuit board and substrate for printed circuit using said prepreg

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5733823
SERIAL NO

08706691

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There are provided a prepreg for a printed circuit board which comprises a glass cloth impregnated with a flame retardative resin composition comprising a (A) resin composed of a (a) styrenic polymer having syndiotactic configuration, a (b) polymer having compatibility with or affinity for the component (a) and further containing polar group, and a (c) thermoplastic resin other than the components (a) and (b) and/or a rubbery elastomer; a (B) halogenated polystyrene in which the amount of halogen atoms contained in halogen compounds generated under specific conditions is at most 1000 ppm by weight; a (C) flame retardant aid; an (D) organic filler or inorganic filler; and the above glass cloth, and also a substrate for printed circuit which comprises the prepreg or a laminate comprising a plurality of the prepregs laminated on each other, at least one side of the prepreg or laminate being laminated with a metallic layer. The above substrate is greatly improved in resistance to electrolytic corrosion and imparted with high reliability, and thus can cope with high density commercial devices.

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Patent Owner(s)

Patent OwnerAddress
IDEMITSU PETROCHEMICAL CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sugioka, Taizou Ichihara, JP 3 84
Yamao, Shinobu Ichihara, JP 18 158

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