Optical device assembly and its preparation using metallic bump bonding and a stand-off for bonding together two planar optical components
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United States of America Patent
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Mar 31, 1998
Grant Date -
N/A
app pub date -
Mar 29, 1996
filing date -
Dec 22, 1994
priority date (Note) -
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Abstract
An optical device assembly includes a planar optical filter and a planar sensor having an optically active area. The optical filter and the sensor are joined together with a gap therebetween by a standoff structure extending between the optical filter and the sensor. The standoff structure is positioned at a location outside of the optically active area of the planar sensor. The standoff structure includes a standoff element, a first bonding element between the standoff and the filter, and a second bonding element between the standoff and the sensor. The two bonding elements each preferably comprise a cold-weldable indium bump. If the standoff structure, the filter, or the sensor is made of a material to which indium does not readily cold weld, a bonding pad of a material such as titanium/nickel can be inserted to facilitate the cold welding.
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