Polycide bonding pad structure
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United States of America Patent
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-
Mar 31, 1998
Grant Date -
N/A
app pub date -
Jan 28, 1997
filing date -
Sep 30, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A bonding pad adapted for use with an Aluminum wire that resists stresses that would otherwise peel the pad from the substrate. The pad has a polysilicon layer adhered to an insulating layer on a semiconductor substrate, a overlying refractory metal polycide layer, a second polysilicon layer, a refractory metal layer, and a thick Aluminum alloy bonding pad.
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