Method of forming conductive bumps on die for flip chip applications
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United States of America Patent
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Apr 7, 1998
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N/A
app pub date -
Jul 17, 1996
filing date -
Mar 7, 1996
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Abstract
The present invention relates to an improved method for forming a UBM pads and solder bump connections for flip chip which eliminates at least one mask step required in standard UBM pad forming processes. The method also includes repatterning bond pad locations.
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