Hermetically sealed dies and die attach materials
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United States of America Patent
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Apr 7, 1998
Grant Date -
N/A
app pub date -
Jun 5, 1995
filing date -
Jun 5, 1995
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Abstract
A semiconductor die is packaged in a hermetically sealed ceramic dual in-line package (cerdip) with a non-standard polysulfone film, or with a paste made from the film, as a die attach material. A cerdip process heats to temperatures of at least about 380.degree. C. The paste is produced by dissolving the film with NMP or with a blend including NMP, and adding a thixotropic agent. The paste or film forms a bond in a cerdip with less than 5000 ppm moisture without using a getter.
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