Monocrystalline ceramic coating having integral bonding interconnects for electrostatic chucks
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United States of America Patent
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Apr 7, 1998
Grant Date -
N/A
app pub date -
Mar 6, 1997
filing date -
Mar 6, 1997
priority date (Note) -
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Abstract
An electrostatic chuck (20) comprises at least one mesh electrode (30) on an underlying dielectric layer (25), the mesh electrode having apertures therethrough. A monocrystalline ceramic (28) covers the mesh electrode (30). The monocrystalline ceramic (28) comprises a layer of large crystals substantially oriented to one another, the layer of crystals having a resistivity sufficiently high to electrically insulate the mesh electrode (30). The monocrystalline ceramic (28) further comprises integral bonding interconnects (40) that form a unitary structure with the layer of large crystals, the bonding interconnects extending through the apertures in the mesh electrode (30) to bond directly to the underlying dielectric layer (25), substantially without adhesive.
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