Manufacturing method for magnetic head junction board
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United States of America Patent
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Apr 14, 1998
Grant Date -
N/A
app pub date -
Apr 12, 1996
filing date -
Apr 13, 1995
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method of manufacturing a magnetic head junction board wherein a laminated plate having a springy metal layer and a conductive layer is prepared. A circuit wiring pattern is formed on the conductive layer by photoetching and the springy metal layer is formed into a predetermined shape by etching. The circuit wiring pattern is provided with a surface protecting layer which leaves holes exposed at the ends of the circuit wiring pattern. Then, the holes are filled with conductive metal to form bump-shaped terminals such that the ends on one side jut out of the surface protecting layer. Lastly, the springy metal layer is bent into a predetermined shape so that the bump-shaped terminals face against each other. Alternative process are also disclosed.
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