Method for forming a solder bump
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United States of America Patent
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Apr 14, 1998
Issued Date -
N/A
app pub date -
Apr 19, 1996
filing date -
Apr 19, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The solder bump apparatus includes a substantially conductive region (14) and a slot (16) projecting from the substantially conductive region (14). A solder resist region (12) at least in part surrounds a perimeter of the substantially conductive region (14) and a perimeter of the slot (16). A solder bump (22) is formed on the conductive region (14) and at least a portion of the solder resist region (12).
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