Electroless metal plating solution
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United States of America Patent
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Apr 14, 1998
Grant Date -
N/A
app pub date -
Sep 13, 1996
filing date -
Nov 11, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electroless metal plating solution comprising metal ions to be reduced for plating onto a substrate and a chelate for the metal to prevent or reduce metal hydroxide precipitates forming and to buffer the amount of metal ions available for reduction, wherein the chelate is at least ethylene diamine disuccinic acid (EDDS).
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