High density integrated circuit package assembly with a heatsink between stacked dies
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United States of America Patent
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Apr 14, 1998
Grant Date -
N/A
app pub date -
Nov 17, 1995
filing date -
Nov 17, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit package assembly with a first die disposed over a first substrate having traces defined therein to provide electrical access to the first die. A heatsink is disposed over the substrate and the first die. A second die and a leadframe is disposed over the heatsink. The leadframe provides electrical access to the second die.
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