Low profile thermally set wrapped cover for a percutaneously deployed stent
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United States of America Patent
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-
Apr 21, 1998
Grant Date -
N/A
app pub date -
Jul 15, 1996
filing date -
Jul 15, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An endoprosthesis assembly for percutaneous deployment on a balloon catheter is disclosed. The assembly includes a radially expandable stent overlied by a tubular, low profile stent cover wrapped over the stent. The wrapped cover is thermally set to maintain its low profile wrapped configuration during deployment of the assembly. At the treatment site, the balloon portion of the catheter is inflated causing the stent to expand radially and the stent cover to unwrap and open to conform to the expanded configuration of the stent.
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