US Patent No: 5,741,326
Number of patents in Portfolio can not be more than 2000
Low profile thermally set wrapped cover for a percutaneously deployed stent
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Apr 21, 1998
Issued date -
Jul 15, 1996
filing date -
08/680,435
serial no -
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Abstract
An endoprosthesis assembly for percutaneous deployment on a balloon catheter is disclosed. The assembly includes a radially expandable stent overlied by a tubular, low profile stent cover wrapped over the stent. The wrapped cover is thermally set to maintain its low profile wrapped configuration during deployment of the assembly. At the treatment site, the balloon portion of the catheter is inflated causing the stent to expand radially and the stent cover to unwrap and open to conform to the expanded configuration of the stent.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 5,562,725 Radially self-expanding implantable intraluminal device | 187 | 1992 | |
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| 5,282,824 Percutaneous stent assembly | 590 | 1992 | |
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| 5,135,536 Endovascular stent and method | 454 | 1991 | |
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| 5,019,090 Radially expandable endoprosthesis and the like | 664 | 1988 | |
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| 5,476,506 Bi-directional crimped graft | 141 | 1994 | |
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| 5,123,917 Expandable intraluminal vascular graft | 602 | 1990 | |
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| 5,163,951 Mesh composite graft | 275 | 1992 | |
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| 4,878,906 Endoprosthesis for repairing a damaged vessel | 646 | 1988 | |
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| 5,330,500 Self-expanding endovascular stent with silicone coating | 477 | 1992 | |