Integrated circuit package fabrication method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 28, 1998
Grant Date -
N/A
app pub date -
Nov 17, 1995
filing date -
Nov 17, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A leadframe integrated circuit package is provide with an interposer structure for electrically interconnecting a die with the leadframe. The interposer has a rigid substrate, which is mounted in the leadframe in place of a conventional integrated circuit die. Interposer bonding pads at the periphery of the substrate are connected to bond fingers of the leadframe, e.g., by wire bonding. The interposer bonding pads are electrically connected to the die using a network of routing lines connected to a central array of interposer array pads. The array of interposer array pads is connected to a corresponding array of die array pads on the die using metal bumps.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully