Hermetic thin film metallized sealband for SCM and MCM-D modules
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United States of America Patent
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Apr 28, 1998
Grant Date -
N/A
app pub date -
Jun 5, 1995
filing date -
Jun 5, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
A module for encapsulating a microelectronic device has a polished mating surface around the periphery of the substrate on which is deposited at least one thin film sealband fabricated at a temperature no greater than about 400.degree. C. The sealband has a thickness of less than about 0.001 in. and comprising a metal capable of wetting molten solder which has a melting point no greater than about 400.degree. C. and adhering to the solder after solidification. A layer of the solder is disposed between the sealbands of the cap and substrate forming a hermetic seal for the module.
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