End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
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United States of America Patent
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-
May 5, 1998
Grant Date -
N/A
app pub date -
Dec 8, 1995
filing date -
Dec 8, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An end effector for a transfer robot used in connection with the manufacture of semiconductor wafers is provided. The end effector is designed to handle very thin (0.005'-0.010') semiconductor wafers which tend to bow during processing. The robot blade or end effector includes a deep pocket for receiving a bowed wafer. The depth of the pocket may be varied depending upon the degree of bowing in the wafers to be handled. Unlike ordinary wafer transfer devices, the present invention requires the wafer to be transferred with the surface bearing the devices facing down. The deep pocket allows the end effector to contact only the edges of the wafer, thus minimizing any defects across the wafer due to handling. The pocket opening is provided with arcuately shaped sloped wafer contact surfaces to prevent wafer sliding during robot movement.
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