Surface mount socket for an electronic package, and contact for use therewith
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United States of America Patent
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-
May 5, 1998
Grant Date -
N/A
app pub date -
Nov 30, 1995
filing date -
Nov 30, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A socket for an electronic package comprises a dielectric housing having contacts each with a surface mount section extending below a bottom surface of the housing for engagement with a respective circuit trace on a circuit board. The surface mount section of each contact has a convex bottom surface with a shape which simulates at least a lower surface portion of a solder ball, whereby the socket imitates the footprint of a ball grid array package. A contact having a convex bottom surface which simulates a solder ball is also disclosed
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