Multi-zone method for controlling voc and nox emissions in a flatline conveyor wafer drying system
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United States of America Patent
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May 12, 1998
Issued Date -
N/A
app pub date -
Jun 10, 1996
filing date -
Feb 14, 1995
priority date (Note) -
Expired
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Abstract
Environmental enhancement by controlling volatile organic compound (VOC) and NO.sub.x emissions in a flatline wafer drying system. The method is characterized by advancing the wafers of the type used in manufacture of oriented strand board (OSB) on a flatline conveyor embodying a plurality of dryer zones. Particularly, heating the dryer zones in successive lower temperatures in the range 500.degree. F. to 200.degree. F. by flowing heated air upwardly through the flatline wafer drying conveyor; removing VOC-rich exhaust air from a primary dryer zone while flowing heated air upwardly therein and removing VOC-rich exhaust air from a secondary dryer zone while flowing heated air from therein.
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