Thermal probe assembly with mold-over crimp sensor packaging

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5749656
SERIAL NO

08914201

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention generally includes a thermal sensor assembly for a vehicle application including an insert molded part having a thermistor/wire sub-assembly and terminal that are assembled with a 'F' crimp and resistance welded that are insert molded to a pre-mold or connector that has a shut-off plate seal on the terminal's insulation crimp. The invention provides a more robust package that is resistant to vibration, insulates the terminals from shorting and permits further handling of the sub-assembly without damage to the terminals. Further, the thermistor can be very small and a very small wire can be used to connect the terminal to the thermistor element. Because a smaller thermistor can be utilized, a much smaller probe tip can be design into the thermal sensor assembly. The insert molded part can either be a preform for press-fit applications or a male sensor connector for applications requiring a metal housing. The pre-molded plastic protects the terminals from short circuiting to the sensor shell or other terminal.

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Patent Owner(s)

Patent OwnerAddress
GENERAL MOTORS CORPORATION300 RENAISSANCE CENTER DETROIT MICHIGAN 48265-3000 UNITED STATES OF AMERICA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boehm, Michael James Warren, OH 1 150
Kirkwood, Richard Darrell Bristolville, OH 2 162
Straub, Peter John Warren, OH 2 162

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