Reworkable die attachment to heat spreader
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United States of America Patent
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-
May 12, 1998
Issued Date -
N/A
app pub date -
Sep 21, 1994
filing date -
Dec 10, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A silicon die, such as an integrated circuit, is reworkably bonded to a copper heat spreader. The silicon-copper bond exhibits high compliance under conditions of thermal stress even though there is a significant thermal coefficient of expansion difference between silicon and copper. A compliant adhesive is applied to the surface of one of the silicon die and the copper heat spreader and is cured. Thereafter, a thermoplastic adhesive is applied to bond the silicon die to the copper heat spreader. A composite bond is thereby produced, including a highly compliant layer and a thermoplastic layer. The die may be reworked by heating the thermoplastic adhesive until the bond begins to soften and the die is released.
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