Method for making integrated circuit packaging with reinforced leads
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United States of America Patent
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May 12, 1998
Issued Date -
N/A
app pub date -
Feb 24, 1995
filing date -
Oct 2, 1992
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An intergrated circuit package with plastic or glass reinforcement of leads to increase lead rigidity, to improve lead alignment and positional stability, and to prevent bent leads. The invention is particularly applicable to surface mount packages. For plastic packages, plastic between the leads is formed during molding of the plastic package. For metal packages, the plastic is molded as a separate operation. For ceramic packages with lead frames, glass may be formed as a separate operation or may be formed at the same time as a glass seal for the ceramic package. Reinforcement can optionally be thicker than the leads for increased rigidity. Optional extended lead lengths enable plastic or glass to be formed on either side of the soldered foot area of each lead. No changes to test fixtures or to pick and place equipment are required.
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