Method and apparatus for reducing warpage of an assembly substrate
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United States of America Patent
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May 12, 1998
Grant Date -
N/A
app pub date -
Mar 29, 1996
filing date -
Mar 29, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for reducing warpage of an assembly substrate and providing registration between a surface mount technology (SMT) component and the assembly substrate. The SMT component includes mounting pins extending from the component and capable of engaging corresponding apertures in the assembly substrate. Each mounting pin is registrable with a corresponding aperture in the assembly substrate. The mounting pins are capable of providing an interference fit between the SMT component and the assembly substrate.
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