Plasma treatment apparatus and method

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United States of America Patent

PATENT NO 5753886
SERIAL NO

08598082

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Abstract

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A plasma treatment and apparatus which enables improved uniform plasma treatment over the entire surface of an object to be treated, improved yield, and higher treatment speed is provided. In a gas introduction passage, the gas capable of plasma discharge is preexcited to raise its level of excitation. A first pair of plasma generation electrodes downstream along the gas flow passage use the preexcited gas to generate a plasma in a first plasma generation position. Further downstream, a second pair of plasma generation electrodes positioned in a second plasma generation position, where the activated state of the gas activated in the first plasma region is maintained, activates the gas to generate a plasma containing activated gas species. The object to be treated is treated by the activated gas species in the second plasma region.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATION1-6 SHINJUKU 4-CHOME SHINJUKU-KU TOKYO 160-8801

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoki, Yasutsugu Suwa, JP 9 265
Iwamura, Naoyuki Suwa, JP 1 218

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