Microelectronics package
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United States of America Patent
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May 19, 1998
Issued Date -
N/A
app pub date -
May 14, 1996
filing date -
Oct 8, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached to an RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A sealing cap is attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
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