Stacked dual in-line package assembly
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United States of America Patent
Stats
-
May 19, 1998
Grant Date -
N/A
app pub date -
Nov 20, 1995
filing date -
Nov 20, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Each flat package is provided with locking elements of snap fasteners that allow several packages to be assembled into a stack so as to align the leads of each package with respect to the leads of other packages. The leads projecting from both edges of the stack package assembly are inserted into a pair of PC boards having holes arranged so as to accommodate the leads of the assembly. The leads of the PC boards are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly.
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