Stackable double-density integrated circuit assemblies
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United States of America Patent
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May 19, 1998
Grant Date -
N/A
app pub date -
Nov 29, 1995
filing date -
Nov 29, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Integrated circuit (IC) packages having leads projecting in the vertical direction are provided with male and female locking elements of snap fasteners that allow a pair of IC packages to be stacked into a module so as to align the leads of one package with the leads of another package. The leads of the packages are soldered to a PCB that carries the external conductors to be connected with the inner circuits of the packages. The male locking element on one of the IC packages is tightly engaged with the female locking element on another IC package to prevent the soldered leads of one package from touching the leads of another package. Multiple modules are positioned on the PCB to double the packaging density of the PCB.
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