C4 substrate contact pad which has a layer of Ni-B plating
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United States of America Patent
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May 26, 1998
Grant Date -
N/A
app pub date -
Jun 24, 1996
filing date -
Jun 24, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A flip chip integrated circuit package which has a layer of nickel-boron (Ni--B) on the contact pads of the package substrate and a layer of nickel-phosphorus (Ni--P) on the pins of the substrate. A layer of gold is plated onto the layers of nickel. An integrated circuit with a plurality of solder bumps is placed onto the contact pads of the substrate. The package is heated to reflow the solder bumps, gold and nickel-boron into solder joints that attach the integrated circuit to the substrate. The package is then typically shipped and mounted to a printed circuit board by soldering the pins to the board.
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