Monitoring the bond line temperature in thermoplastic welds
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United States of America Patent
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Jun 2, 1998
Grant Date -
N/A
app pub date -
Oct 26, 1995
filing date -
Oct 26, 1995
priority date (Note) -
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Abstract
Quality welds are highly dependent upon achieving appropriate temperatures everywhere along the bond line. The present invention uses multinode thermocouples to measure the bond line temperature in real time and to provide control signals for the moving coil (welding head).
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Cited Art Landscape
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