Multi-layer wiring structure having varying-sized cutouts
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United States of America Patent
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-
Jun 2, 1998
Issued Date -
N/A
app pub date -
Feb 18, 1997
filing date -
Jun 1, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit having a multi-layered metal wiring structure with interlayer insulating films therebetween. A small cutout is made in a metal wiring when it is desirous to have the metal wiring touch a contact formed in a through hole passing through said cutout. A larger cutout is made in a metal wiring when it is desirous to have the metal wiring remain spaced from a contact formed in a through hole passing through said cutout.
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Cited Art Landscape
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