Tamper resistant validation marks
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United States of America Patent
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Jun 9, 1998
Grant Date -
N/A
app pub date -
Feb 16, 1996
filing date -
Feb 16, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention includes a pattern of fine slits formed in the material of document where sensitive information is intended to be printed or imprinted, wherein the slit pattern modifies the tensile strength of the substrate. In addition, the slit pattern modifies the toner or ink permeability of a substrate to facilitate the penetration of the toner or ink printed or imprinted on the surface of document into the substrate. Further, the design of the slit pattern can be coordinated with a latent image pattern to comprise optical properties such that the physical response of a typical duplicating or photocopy device to the validation mark will allow a copy to be easily discerned from an original.
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