Sensors for a linear polisher
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United States of America Patent
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Jun 9, 1998
Issued Date -
N/A
app pub date -
Feb 6, 1997
filing date -
Apr 26, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A technique for utilizing sensors to monitor the polishing of a semiconductor wafer when a linear polisher is utilized to polish the wafer. The sensors are distributed along the surface or are coupled to openings along the surface to monitor the on-going polishing process. The sensed information from the sensors are processed in order to provide feedback for compensating the fluid dispensing when fluid platens are used and/or the downforce exerted by the wafer carrier.
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