Structure for testing bare integrated circuit devices
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United States of America Patent
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Jun 9, 1998
Grant Date -
N/A
app pub date -
Feb 21, 1996
filing date -
Feb 28, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A test probe structure for making connections to a bare integrated circuit device or a wafer to be tested comprises a multilayer printed circuit probe arm which carries at its tip an MCM-D type substrate having a row of microbumps on its underside to make the required connections. The probe arm is supported at a shallow angle to the surface of the device or wafer, and the MCM-D type substrate is formed with the necessary passive components to interface with the device under test. Four such probe arms may be provided, one on each side of the device under test.
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