Method and system for testing an electronic module mounted on a printed circuit board
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United States of America Patent
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Jun 9, 1998
Grant Date -
N/A
app pub date -
Jan 5, 1996
filing date -
Jan 5, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method in system for the testing of the electrical characteristics of an electronic module mounted on a printed circuit board. The method and system monitors selected signals from the Bottom Signal Pads of the electronic module. Thus, eliminating the need for a prototype or specialized printed circuit board in order to perform desired testing of signals.
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