Cost effective structure and method for interconnecting a flip chip with a substrate
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United States of America Patent
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Jun 9, 1998
Grant Date -
N/A
app pub date -
Oct 10, 1996
filing date -
Oct 10, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrical interconnection between a flip chip and a substrate. The interconnection includes a substrate having conductive pads to which wire bumps are attached. Each wire bump includes an elastically deformable stub section attached to the ball section, and a pointed tip. The pointed tip pierces a soft conductive layer located on a conductive pads of a flip chip. The elastic deformation of the stub section provides for consistent electrical connections between the flip chip and the substrate when the flip chip and the substrate are non-planar. An adhesive is located between the flip chip and the substrate and encompasses the wire bumps.
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