Semiconductor device with a decoupling capacitor mounted thereon having a thermal expansion coefficient matched to the device

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United States of America Patent

PATENT NO 5767564
SERIAL NO

08678948

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Abstract

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A semiconductor device having a semiconductor element mounted on an insulating substrate and a decoupling capacitor provided on the semiconductor element. The semiconductor device minimizes the occurrence of switching noise. The semiconductor device comprises an insulating substrate, a semiconductor element mounted on said insulating substrate, and a decoupling capacitor which is joined to the upper surface of said semiconductor element and is electrically connected to said semiconductor element, wherein said decoupling capacitor has a coefficient of thermal expansion close to the coefficient of thermal expansion of said semiconductor element, and is electrically connected to said semiconductor element by soldering and is further secured to said semiconductor element.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
KYOCERA CORPORATIONOSAKA2466

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furuzawa, Akira Kokubu, JP 2 88
Kunimatsu, Yasuyoshi Kokubu, JP 3 97
Sata, Akifumi Kokubu, JP 3 101

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