Test head cooling system
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United States of America Patent
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Jun 16, 1998
Issued Date -
N/A
app pub date -
Mar 7, 1997
filing date -
Dec 22, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a test head cooling system for cooling test heads of a semiconductor IC test apparatus in an enclosed structure. A sealed housing is provided in a test head wherein an air duct is formed in a wall of the sealed box so that cooling air flow effectively. Several thousands of cables are connected to sockets of a plurality of boards. The boards are fixed in board racks by inserting the boards to sockets of the board racks. Gaps between the boards are arranged to provide good ventilation. A cooling pipe is connected to two heat exchangers for circulating cooling medium. A flexible hose for circulating the cooling medium is connected to one of the heat exchangers. The flexible hose is connected to an outside cooling apparatus so as to freely control the temperature of the cooling medium circulating inside the heat exchanger.
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