Method and apparatus for polishing semiconductor substrate
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United States of America Patent
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Jun 23, 1998
Grant Date -
N/A
app pub date -
Aug 7, 1996
filing date -
Aug 24, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
An elastic polishing pad is adhered to a surface of a flat substrate holder of a platen. A substrate holding head which holds and rotates a semiconductor substrate is provided above a first region extending from the central portion to peripheral portion of the polishing pad. The semiconductor substrate rotated by the substrate holding head is pressed against the first region of the polishing pad. A slurry is dropped in a prescribed amount from an abrasive supply pipe onto the polishing pad. Pad pressing means for pressing the polishing pad is provided above a second region extending from the central portion to peripheral portion of the platen. The pad pressing means has a disk-shaped pad pressing plate and a rotary shaft for holding the pad pressing plate.
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